Supply, Delivery and Installation of Solder Jetting Equipment
Supply, delivery and installation of solder jetting equipment for semiconductor and photonic device packaging at the National Centre for Advanced Semiconductor Packaging. The equipment will be used to integrate devices into advanced packages.
- Closed31 August 2026
- ValueNot stated
- BuyerUniversity of Strathclyde
- WhereUniversity of Strathclyde, Glasgow
- CategoryLaboratory & precision equipment
- RegionScotland
You'll want to look if you supply specialist semiconductor assembly or packaging equipment and can handle delivery and installation of precision machinery
Possible incumbent
Inseto UK Limited supplied sinter bonding capability to this buyer in May 2026. Inferred from prior awards to this buyer, not confirmed.