Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter
University of Strathclyde needs an automatic die inspection sorter for photonics packaging. This is part of the National Centre for Advanced Semiconductor Packaging (NCASP), a UK facility for semiconductor assembly and test.
- Closed1 September 2026
- Value£1.2m
- BuyerUniversity of Strathclyde
- WhereUniversity of Strathclyde, Glasgow
- CategoryLaboratory & precision equipment
- RegionScotland
You'll want to look if you manufacture or supply automatic optical inspection and sorting systems for semiconductor die, particularly for photonics applications
Possible incumbent
Inseto UK Limited supplied sinter bonding capability to this buyer in May 2026, though that is a different piece of equipment Inferred from prior awards to this buyer, not confirmed.