Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder
Supply, delivery, installation and commissioning of a submicron flip-chip die bonder for the National Centre for Advanced Semiconductor Packaging. This is high-specification semiconductor assembly equipment for a university research facility.
- Closed4 September 2026
- ValueNot stated
- BuyerUniversity of Strathclyde
- WhereUniversity of Strathclyde
- CategoryLaboratory & precision equipment
- RegionScotland
You'll want to look if you supply or are an authorised distributor for advanced semiconductor packaging equipment, particularly flip-chip die bonders
Possible incumbent
Inseto UK Limited won a related sinter bonding capability contract for this buyer in May 2026. Inferred from prior awards to this buyer, not confirmed.