Supply, Delivery and Installation of Sinter Bonding Capability
University of Strathclyde's National Manufacturing Institute Scotland needs to buy equipment capable of forming sintered bonds between dies, substrates, heat sinks, and interconnection parts for power electronic semiconductor packaging. The equipment must handle multi-die packages with varying component heights and support double-sided cooling.
- Closed26 January 2026
- Value£900k
- BuyerUniversity of Strathclyde
- WhereNational Manufacturing Institute Scotland, University of Strathclyde
- CategoryLaboratory & precision equipment
- RegionScotland
You'll want to look if you manufacture or supply precision equipment for semiconductor assembly and packaging, particularly sinter bonding systems.