Die Bonding System
University of Bristol wants to buy a die attach/bonding system capable of ultrasonic, flip-chip, and UV curing processes. The system must handle single-die bonding and small production runs, with motorised operation and recipe storage.
- Closed16 July 2026, 12 noon
- Published1 July 2026
- Value£215k
- BuyerUniversity of Bristol
- WhereUniversity of Bristol
- CategoryLaboratory & precision equipment
- RegionSouth West
You'll want to look if you supply or distribute semiconductor assembly equipment, particularly semi-automated die bonding systems with multi-process capability