Contracts
Laboratory & precision equipment in Scotland
Public sector contract notices in laboratory & precision equipment covering Scotland, from Find a Tender and Contracts Finder.
Laboratory & precision equipment notices in Scotland
-
ClosedSmall-firm friendly
Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter
University of Strathclyde needs an automatic die inspection sorter for photonics packaging. This is part of the National Centre for Advanced Semiconductor Packaging (NCASP), a UK facility for semiconductor assembly and test.
-
ClosedSmall-firm friendly
Procurement of Bioreactors for Carbon Loop
University of Edinburgh needs bioreactor equipment for their Biomanufacturing Hub to process carbon-based waste. The procurement is for the Carbon Loop project.
-
ClosedSmall-firm friendly
Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder
Supply, delivery, installation and commissioning of a submicron flip-chip die bonder for the National Centre for Advanced Semiconductor Packaging. This is high-specification semiconductor assembly equipment for a university research facility.
-
ClosedSmall-firm friendly
Supply, Delivery and Installation of Optical Alignment & Packaging System
University of Strathclyde is procuring an optical alignment and packaging system for photonics packaging applications at the National Centre for Advanced Semiconductor Packaging (NCASP). The system will perform active and passive alignment functions.
-
ClosedSmall-firm friendly
Supply, Delivery and Installation of Laser Waveguide Writing Equipment
University of Strathclyde needs laser waveguide writing equipment for photonics packaging applications at the National Centre for Advanced Semiconductor Packaging. Supply, delivery and installation required.
-
ClosedSmall-firm friendly
Supply, Delivery and Installation of Automated Laser Chip Burn-in Tester
University of Strathclyde needs an automated laser chip burn-in tester for the National Centre for Advanced Semiconductor Packaging. The tester will be used for quality assurance of semiconductor devices in a UK-based packaging and test facility.
-
ClosedSmall-firm friendly
Supply, Delivery and Installation of Wafer-Level Optical Tester
University of Strathclyde needs a wafer-level optical tester to characterize DFB laser arrays and silicon photonic integrated circuits for the National Centre for Advanced Semiconductor Packaging. Supply, delivery and installation only.
-
ClosedSmall-firm friendly
Supply, Delivery and Installation of High Accuracy Motion Control and Imaging System
University of Strathclyde is procuring a high-accuracy motion control and imaging system for the National Centre for Advanced Semiconductor Packaging (NCASP). The system will support UK semiconductor packaging, test and metrology operations.
-
ClosedSmall-firm friendly
Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System
University of Strathclyde needs an Inductively Coupled Plasma Chemical Vapour Deposition System for the National Centre for Advanced Semiconductor Packaging. The system will support UK semiconductor device packaging and testing.
-
ClosedSmall-firm friendly
Supply, Delivery and Installation of Matrix Plasma Asher
University of Strathclyde is purchasing a Matrix Plasma Asher for the National Centre for Advanced Semiconductor Packaging. The equipment will be supplied, delivered and installed.